Syntegon to debut neXt automation platform in North America at PACK EXPO
Syntegon will present its neXt automation system architecture in North America for the first time at PACK EXPO International 2026 in Chicago, 18-21 October, alongside two new modular machine platforms, the HFX flow-wrapper and the TRX topload cartoner. Both are retrofit-capable building blocks within the neXt architecture, allowing sealing technologies and software features to be added as requirements change. The system will be demonstrated daily at the company's booth in the South Hall.
Why this mattersModular, retrofit-capable platforms let food packagers upgrade lines incrementally rather than rebuild them, as labour costs and product variety rise.
- Syntegon will show its neXt system architecture in North America for the first time at PACK EXPO International, 18-21 October 2026, in Chicago, booth S-3514.
- Two new modular platforms launch alongside neXt: the HFX flow-wrapping line for primary packaging and the TRX topload cartoning line for secondary packaging.
- The HFX3 runs at up to 1,000 products per minute, handling product lengths of 2 to 12 inches and widths of 0.5 to 7.5 inches.
- The TRX platform scales to 200 cartons per minute; the TRX21 reaches 80 cartons per minute with infeed speeds up to 1,500 products per minute.
- Format changes on the TRX platform take 10 minutes.
- Both platforms are retrofit-capable and are integrated with Syntegon's robotic pick-and-place platform.