Tageos launches microwave-safe RFID inlays for food packaging

RFID specialist Tageos has launched two microwave-compatible RAIN RFID inlays, the EOS-450 MW M830 and EOS-450 MW UX, aimed at item-level tracking of packaged food that can be defrosted or heated without removing the tag. The products, unveiled at LOUPE Americas 2026 in Chicago, target food retail and quick-service restaurant applications and are the first of a planned range of microwave-compatible inlays.

Why this mattersTag-through-heating RFID removes a labelling step for retailers and QSR operators, widening item-level tracking into fresh and reheated food categories.

• Tageos launched the EOS-450 MW M830 and EOS-450 MW UX RAIN RFID inlays on 17 September 2026.
• The inlays are designed to withstand microwave heating without arcing or sparking, avoiding tag removal before use.
• The EOS-450 MW M830 uses Impinj's M830 RAIN RFID IC with 128-bit EPC memory.
• The EOS-450 MW UX uses NXP's UCODE X platform with 96 to 208-bit configurable EPC memory and up to 32 bits of user memory.
• The products are showcased at LOUPE Americas 2026 in Chicago and are available in dry, wet clear, paper-face and plastic-face formats.
• Tageos said it plans further microwave-compatible variants for additional food packaging formats.

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